RunCore SSD, the leading SSD manufacturer in China recently announced that they will
launch a new micro-chip package (MCP) product, disk-on-chip SSD rSSD T100, which will be
released this coming October 2011.

rSSD T100 is a new generation of embedded SSD product of RunCore. It is a multi-chip
package which contains multi-interconnected chips that will be used in mobile phones, PDAs,
notebook computers or tablet PC or any electronics applications that will use an embedded
storage and requires a very limited space in the design board:
1. Very small form factor using BGA package
2. Excellent performance
3. Extremely low power consumption
4. Can work in a harsh environment
This product can be widely used in handheld POS
machine, blu-ray gaming machines, image processing
equipments, automatic information inquiry devices, bank
counters, communication equipments, industrial control
machines, and other embedded devices for industrial and
military applications.
The product also supports standard SSD functions like
SATA 1.5Gb/s and 3.0Gb/s transfer rate, ECC, wear
leveling, trim function, data protection and even SMART
commands to monitor the life expectancy of the product.
This MCP also operates in commercial (0C to +70C) and
industrial temperature (-40C to +85C).

It has a unique and proprietary
design with its logo shows on the
ball-pins layout.

"MCP products will be the next high market demand in the future, and we foresee that this
growth will increase exponentially ", said Jack Wu, the CEO of RunCore.

Based on RunCore's new product development roadmap, MCP first samples will be released
in September this year, and the technical documents including the various test results will be
completely released in October.
The successful development of rSSD T100 symbolizes that RunCore has taken a new big
step to the new embedded market.

For more information about RunCore, please visit our website?www.runcore.com.cn or contact us at the
hotline?400-6196-800.