May 17th, 2013, China – BIWIN, a world-leading expert in the development and manufacture of flash memory, will participate in Taipei’s international computer trade show, COMPUTEX from June 4th to the 8th. The company will be presenting an SSD Lab theme to showcase a variety of flash memory solutions. They will be located at Booth No. J0218.

BIWIN will be showing their latest products for various market segments. Business solutions are one of the main focuses. There are multiple SSDs tailored for tablets, smartphones, POS systems, GPS navigation units and other equipment. And the show will boast the on-site release of the mSATA (M5301) with the DEVSLP function and the Next Generation Form Factor (NGFF) for Intel’s latest Ultrabook platform. There are a variety of forms of embedded SSDs and embedded chips (eMMC / EMCP) that will be on display as well.

BIWIN will be also showcasing solutions especially for the industrial market. BIWIN industrial grade products provides multiple interfaces and form factors of SSDs with SLC  and are able to withstand harsh operating temperature environments from -40 to 85 degrees Celsius.

In the field of consumer-level solutions, BIWIN has launched a variety of USB 3.0 flash drives, new 2.5” SATAIII with power failure protection function (C8380) and 1000X CF SSD card. This year there will also be the debut of their WIFI NAS, the WF1 and an external portable SSD, the EX1.

BIWIN is welcoming all partners and members of the media to visit them this year at COMPUTEX to learn about their products and create new relationships and contact opportunities.

COMPUTEX TAIPEI 2013-BIWIN Location

Date: 2013, June 4th to 8th

Venue: Taipei World Trade Center - Nangang Exhibition Hall (No. 1, Jingmao 2nd Rd.)

Booth Number: J0218